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　Aluminum Based Copper-clad Laminate Sheet

　Copper Based Copper-clad Laminate Sheet

Aluminum Based Copper-clad Laminate Sheet

Description and Application
　　 Aluminum base copper-clad laminate have excellent flame retardant，high mechanical strength，dimensional stability etc. Especially it has very good heat sink，electromagnetic shielding and solder float.

　　It’s widely used for the modifier and sparker on fire for motorcycle and mobile，power LED，sound box， power supply module and acoustics shielding system etc.
　　 Note：Chaoshun specially produces Metal Base Copper-Clad Laminates，and our products have been compiled series with all complete specifications.

　● The tapy and specification of Aluminum based Laminates CCAF-01，CCAF-04-A，CCAF-05etc.and0.8mm，1.0mm， 1.5mm，2.0mm，3.0mm etc.

　● thickness of the copper:18um,35um,70um,105um,140um..

Base size: 330mm by 380mm (13〞by 15〞); 500mm×600mm (20〞×24〞)；
380mm×660mm (15〞×26〞)

CCAF-01 Aluminum-base copper-clad laminate

Test base :
                    Thickness copper：35um
                    Thickness of the diclectric：70um
                    Cu base：1.5mm
The result of the test：

Item	Test item			Technology request	Unit	Test result
1	Peel Strength		A	≥1.8	N/mm	2.0
1	Peel Strength		After thermal stress（260℃）	≥1.8	N/mm	1.8
2	Blister test AfterThermal stress（288℃，2min）			288℃ 2 min No delaminating	/	Ok
3	Flammability(A)			FV-O	/	FV-O
4	Thermal resistance			≤2.0	℃/W	1.0
5	Surface Resistivity	A		≥1×10⁵	MΩ	5×10⁷
5	Surface Resistivity	Constant humidity treatment (90%,35℃,96h)		≥1×10⁵	MΩ	2×10⁶
6	Volume Resistivity	A		≥1×10⁶	MΩ·m	4×10⁸
6	Volume Resistivity	Constant humidity treatment (90%,35℃,96h)		≥1×10⁶	MΩ·m	5×10⁷
7	Dielectric Breakdown(DC)			≥28.5	KV/MM	31
8	Dielectric constant（1MHz）（40℃，93%，96h）			≤4.4	/	4.2
9	Dielectric dissipation factor（1MHz）（40℃，93%，96h）			≤0.03	/	0.02

CCAF-04-A Aluminum-base copper-clad laminate(

Review SGS Test Report)

The test base：
                             Thickness of the copper：35um
                             Thickness of the diclectric：80um
                             Thickness of the aluminum-base：1.5mm
The result of the test：

Item	Test item			Technology request	Unit	Test result
1	Peel Strength		A	≥1.0	N/mm	1.05
			After thermal stress（260℃）	≥1.0	N/mm	1.05
2	Blister test AfterThermal stress（288℃，2min）			288℃ 2 min No delaminating	/	OK
3	Thermal resistance max			≤2.0	℃/W	0.65
4	Flammability(A)			FV-O	/	FV-O
5	Surface Resistivity	A		≥1×10⁵	MΩ	5.0×10⁷
		Constant humidity treatment (90%,35℃,96h)		≥1×10⁵	MΩ	4.5×10⁶
6 7	Volume Resistivity	A		≥1×10⁶	MΩ·m	1.0×10⁸
		Constant humidity treatment (90%,35℃,96h)		≥1×10⁶	MΩ·m	1.9×10⁷
8	Dielectric Breakdown(DC)			≥25	KV/MM	31
9	Dielectric constant（1MHz）（40℃，93%，96h）			≤4.4	/	4.2

CCAF-05 Aluminum-base copper-clad laminate(

Review SGS Test Report)

The test base：
                           Thickness of the copper：35um
                           Thickness of the diclectric：80um
                           Thickness of the aluminum-base：1.5mm
The result of the test：

Item	Test item			Technology request	Unit	Test result
1	Peel Strength		A	≥1.0	N/mm	1.08
1	Peel Strength		After thermal stress（260℃）	≥1.0	N/mm	1.05
2	Blister test AfterThermal stress（288℃，2min）			288℃ 2 min No delaminating	/	OK
3	Thermal resistance max			≤2.0	℃/W	0.45
4	Flammability(A)			FV-O	/	FV-O
5	Surface Resistivity	A		≥1×10⁵	MΩ	3.68×10⁷
5	Surface Resistivity	Constant humidity treatment (90%,35℃,96h)		≥1×10⁵	MΩ	3.39×10⁶
6	Volume Resistivity	A		≥1×10⁶	MΩ·m	4.2×10⁸
6	Volume Resistivity	Constant humidity treatment (90%,35℃,96h)		≥1×10⁶	MΩ·m	3.17×10⁶
7	Dielectric Breakdown(DC)			≥25	KV/MM	60
8	Dielectric constant（1MHz）（40℃，93%，96h）			≤4.4	/	4.24
9	Dielectric dissipation factor（1MHz）（40℃，93%，96h）			≤0.035	/	0.033